Wire peel test is a test for wire bond strength at the second bond. It consists of applying an upward force under the wire at the second bond post, pulling the wire away from the bond post. The same wire pull tester is used in performing the test. The failure mode for wire peel test is almost same with wire pull test as shown below:
1) Ball bond lifting
2) Break at stitch
3) Center wire break
4) Second bond or wedge bond lifting
Figures below show the illustration for wire peel testing and the result of break at stitch and wedge lifted.
tool's position
break at stitch
wedge lift
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