Ball Grid Array (BGA)

Ball Grid Array (BGA) is a surface-mount package that utilizes an array of metal spheres or balls providing external electrical interconnection. The balls are composed of solder, and are attached to a laminated substrate at the bottom side of the package. The die of the BGA is connected to the substrate either by wire bonding or flip chip connection. The substrate of a BGA has internal conductive traces that connect the die-to-substrate bonds to the substrate-to-ball array bonds.

PBGA

The wire-bonded PBGA (Plastic Ball Grid Array) package is an excellent package for mid- to high-performance devices that require low inductance, ease of surface mounting, relatively low cost, and excellent package reliability. Additional copper layers in the substrate allow for increased power dissipation capability with the Thermally Enhanced PBGA (TEPBGA).

Features:

• Custom substrate designs / ball maps for maximum routing flexibility and electrical performance Custom ball patterns / full arrays / depopulated arrays available Substrates use standard organic PCB manufacturing technology Two or four layer substrates available (ground / power planes) Proven reliability in automotive / industrial environments Capability to withstand lead-free reflow processes (260°C reflow)
• Lead-free solder balls available (95.5% Sn, 4% Ag, 0.5% Cu

TBGA

The TBGA (Tape Ball Grid Array) is a mid to high end BGA packaging solution for applications needing excellent thermal performance without an external heatsink.

Features:

• Improved thermal performance over std PBGA packages <15°c/watt style="font-size: 10pt;">Custom substrate designs / ball maps for maximum flexibility and electrical performance Custom ball patterns / full array / depopulated arrays available; 1.0 mm to 1.27 mm pitch Substrates use standard PCB manufacturing technology Maximum thickness from 1.30 mm to 1.60 mm

• Fine Lines/Spacing Geometry (35/35 μm) on two sides of polyimide substrate