The VEry 1st task!!

Basically, I am in the wire bonding team under TSO. (Technology Solution Organization) Thus, my tasks are related to measurement and testing on the integrated circuits that have been bond by my supervisor. And basically this is the magnified look of a wire bonded chip.

Under wire bond team..there's few groups of IC such as flip chip, sensor, QFP, RF, BGA and etc. And I am in charge of BGA(Ball Grid Array).

the picture of BGA chip
So the first task that i gonna do is to measure the BBD and BBH by using HISOMET II.

this is the Hisomet II that commonly used in industry
Hisomet is a non-contact depth measuring microscope that has been designed based on the optical focal point detection system.
The precise focus indicator is adopted, so that the measurements of height, depth, steps, etc. are made possible simply by coinciding the two halves of an index graticule while observing the surface of a point of measurement.
As measurements can be made without concern for causing distortion or nicks to a specimen, Hisomet is ideal for measuring electronic components such as ICs and other precision parts.

Hisomet is highly appreciated by manufacturers for its accurate measurements and inspections of objects, such as ICs, magnetic heads, electronic components, precision parts, etc.

Material and forms of specimens used in these industries are diversified.

Precise Focus Indicator

	Focused Condition	Out of Focus Condition
Black graticle
White-stripe graticle

The concern of my team is usually the accuracy of the size of ball bond that produced by wire bonder. BBD (Ball Bond Diameter) is the width of the ball that bond to the die. BBH (Ball Bond Height) is the height of ball that bond to the die.

the digital screen that showing the measurement's values
The X and Y is the values of ball bond diameter
while Z is the height of the ball bond.
In order to get the BBD, we take the mean of measured values of X and Y.

The Hisomet II in the material lab

doing the measurement

observe under scope