A Visit to Production Line

The production line in Fresscale is mainly about assembly and packaging.

So the concern of R&D is also about the wafer saw, wire bonding, molding

which is from front end to the back end.

This is the bunny suit that we have to wear in order to get into production line.

Basically this is the process chart from front to back end:

First Step: Wafer Mount

- Process of providing support to the wafer to facilitate processes from “Wafer Saw” to “Die Attach”

- Wafer and wafer frame attached on a film

- Things to be prevented:

Ø Wafer cracking

Ø Bubble trapping on adhesive side of tape

Ø Scratches on active side of wafer

Ø Non uniform tape tension

Step 2: Wafer Saw

- Process that cuts wafer into individual dies

Step 3: UV Cure

- Reduce the stickiness on the adhesive side of the tape

Step 4: Die Attach

- Processing of attaching the die to the die pad of the support structure

- Adhesive die attach is the process used using epoxy as the adhesive agent

Step 5: Curing

- To harden the epoxy to form a stronger bond hold with the die

- Done in an oven

Step 6: Wire Bonding

- Process that provides electrical connection between the silicone chip and external leads using bonding wires

- Wires are usually made of Gold (Au)

Step 7: Molding

- Is a process of encapsulating the device in a polymer material

Step 8: Post Curing

- The molded material is then sent for further curing in an oven

- Oven settings:

¡ About 5 hours curing time

¡ 175°C

Step 9: Marking

- Is the process of putting identification, traceability and distinguish marks on IC package (device name, company logo, date code, lot ID)

- Molded compounds are laser marked

Step 10: Cutting

- Leadframe goes through a series of shearing and displacement tools which acts to cut and separate the individual IC units

- LGA units are conventionally sawed to isolate the individual units

- Units are then punched out or picked and placed into their respective container slots

Step 11: Packing

- Lots are bubble wrapped and strapped together

- Depending on types of units/customer request, some units are dry vacuum packed

- Packed units are put into a shipment box

Step 12: Shipment

- Ready lots are shipped out to customers or other departments for further testing

Ouchhhhh!!!!

Dage machine is another machine that I have to deal with.
Somehow it's quite hard to pull out the cartridges.
There are few cartridges that being used here...
such as WP 25, BS25, BS250 and etc..
Today I was trying to change the hook of the wire pull cartridge
as the hook is bent and having difficulties in pulling gold wire..
Unfortunately, my hand was cut by the hook.
Luckily, it was the bent hook that ready to dispose..


Dage Machine


Ouchh...it's bleeeding..:(


Oh!! painfull!!

New Name Tag

Finally get my Name tag!!


well..the name tag of trainee is different with engineers and permanent staffs there.
normally the operator which is in contract also using the same tag.
And there is some kind of 'discrimination' by those operator when seeing this tag
and I don't really like to show the side of my tag.

The VEry 1st task!!

Basically, I am in the wire bonding team under TSO. (Technology Solution Organization) Thus, my tasks are related to measurement and testing on the integrated circuits that have been bond by my supervisor. And basically this is the magnified look of a wire bonded chip.

Under wire bond team..there's few groups of IC such as flip chip, sensor, QFP, RF, BGA and etc. And I am in charge of BGA(Ball Grid Array).

the picture of BGA chip
So the first task that i gonna do is to measure the BBD and BBH by using HISOMET II.

this is the Hisomet II that commonly used in industry
Hisomet is a non-contact depth measuring microscope that has been designed based on the optical focal point detection system.
The precise focus indicator is adopted, so that the measurements of height, depth, steps, etc. are made possible simply by coinciding the two halves of an index graticule while observing the surface of a point of measurement.
As measurements can be made without concern for causing distortion or nicks to a specimen, Hisomet is ideal for measuring electronic components such as ICs and other precision parts.

Hisomet is highly appreciated by manufacturers for its accurate measurements and inspections of objects, such as ICs, magnetic heads, electronic components, precision parts, etc.

Material and forms of specimens used in these industries are diversified.

Precise Focus Indicator

	Focused Condition	Out of Focus Condition
Black graticle
White-stripe graticle

The concern of my team is usually the accuracy of the size of ball bond that produced by wire bonder. BBD (Ball Bond Diameter) is the width of the ball that bond to the die. BBH (Ball Bond Height) is the height of ball that bond to the die.

the digital screen that showing the measurement's values
The X and Y is the values of ball bond diameter
while Z is the height of the ball bond.
In order to get the BBD, we take the mean of measured values of X and Y.

The Hisomet II in the material lab

doing the measurement

observe under scope

The Very First Day!!!

Today i woke up at 6.15 in the moring..
It's been a long time that i didn't wake up as this early.
In fact, the traveling car distance from the place i stay to Freescale is within 5-10 minutes. But i am still new here, so i do not know how JAM is the traffic so i decided to depart at 7am. Upon preparing those documents that need to handed in for HR, i also dressing up and put some make up for the good impression.
I have to say that the traffic in federal is really jam and hardly moving and i took 40 min to reach at Freescale.

this is the tag that i get for the temporary used



waiting in the conference room

there was a briefing carried out by the recruitment person in charge, Miss Asriza in here
she explained about trainee's benefits and some basic intro of Freescale.

after that, i was brought to R&D department.


i snap it while on the way to my department
this is the place to store all the stocks and ship to distributors



this is the office place for me in the 3 months time


In the first day i did nothing much. Just some briefing and introduction by supervisor about what the department do and the job of scope. Everything is still new for me.
Hope i get to find out more and get used to be here soon.

My internship's Details

Training place : Freescale Semiconductor, PJ
Working hour : 8am-5.30pm
Supervisor : Mr Cheng Choi Yong
Department: Research and Development
Start Date : 5th April 2010
End Date : 25 June 2010

Initially I stay at UNITEN hostel and i am moving to Subang Jaya (SS15) for 3 months time because my internship located at PJ where it can be seen when passing by the Federal Highway. There's many many question marks i have right now..as in NEW environment..NEW faces...NEW life...Luckily weily is training in the same place as me, so i know that i won't be alone..at least got a companion for lunch. Well, all the BEST to me and all others that undergoing training..